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[Technology Introduction] Semiconductor Lead Frame Dimple Processing

Rich manufacturing experience with diodes and more! Mass production and supply of various lead frames with high precision and high quality.

Our company produces lead frames using stamping molds. To improve the adhesion between the lead frames and resin, we can apply dimple processing to any desired location on both sides of the frame. If you could provide us with the desired locations and the shape of the frame, we would be happy to consider whether we can accommodate your request through technical discussions, so please feel free to let us know. 【Features】 ■ Production of lead frames using stamping molds ■ Dimple processing, which is adopted to enhance the adhesion between the lead frames and resin, can be applied to any desired location on both sides of the frame ■ From mold design and manufacturing to the assembly of stamping molds, we mass-produce various lead frames with high precision and quality *For more details, please refer to the PDF document or feel free to contact us.

• Company：ローム・メカテック
• Price：Other

• Processing Contract
• Transistor
• diode